Beyond Electronics Corporation follows rigorous design practices to guarantee the best possible product for the application and price point.

All products are designed using the latest tools and the latest validation methods.

The icon that lead to this page was the result of a thermal FEA that was done on a custom heat sink for a microprocessor on a PMC board.

The FEA was done in three steps: design the heat sink with Solid Works 3D cad, perform meshing on the part and finally run the thermal analysis on the mesh.

Initial solid model of the heat sink.

Result of meshing the solid part. The mesh size is adjustable to tradeoff accuracy and time to process.

The final thermal model showing the thermal gradient. This die of the processor is centered in the heatsink.

During design validation testing, periodically a problem is found that was not anticipated. Above is an eye diagram of a PCie link showing two problems. The first was that the drive settings needed to be modified to change the drive profile on the transceivers. The second problem was that some additional capacitance was required on the drive circuit to compensate the drive current requirements being slightly higher than initially modeled. Both issues were easily fixed.

For complex assemblies, it is advantageous to perform a full fitting of the hardware prior to assembly. This is an assembly that was done early in the design phase showing a PMC processor board in a Beyond Electronics' PMC stand alone housing with an integrated power supply.